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Material: Copper (Cu), bulk

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Material: Copper (Cu), bulk

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Property↑↓Value↑↓Conditions↑↓Reference↑↓Poisson's Ratio 0.36 Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties. Mechanics of Materials 23(1996), p.314 Specific heat 384.56 J/kg/K At Temp=25 C. CRC Materials Science and Engineering Handbook, p.260 Thermal conductivity 398 W/m/K Value at temp=300 K. CRC Materials Science and Engineering Handbook, p.270-274 Yield strength 100 MPa Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties. Mechanics of Materials 23(1996), p.314 Young's Modulus 128 GPa Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties. Mechanics of Materials 23(1996), p.314 density 8960 kg/m^3 25 degrees C Handbook of the elements, S. Ruben, 2 nd printing (1987), Open Court Publishing Terms of Use | Contact Us | Search