As of 2011, TEL is the largest manufacturer of IC and FPD production equipment in Japan and the third largest in the world. The company was founded as Tokyo Electron Laboratories, Inc. in 1963.
On September 24, 2013 Tokyo Electron and Applied Materials announced a merger. If the merger would have been approved by government regulators, the combined company, to be called Eteris, would have been the world's largest supplier of semiconductor processing equipment, with a total market value of approximately $29 billion. However, on April 26, 2015 the merger was cancelled to due anti-trust concerns in the United States.
On November 11, 1963, Tokyo Electron Laboratories Incorporated was founded by Tokuo Kubo and Toshio Kodaka, largely funded by Tokyo Broadcasting System (TBS), with a capital of over five million yen. Later that year, their office opened in the TBS main building and began manufacturing thousands of quality-control and importing diffusion furnaces made by Thermco and selling Japanese-made car radios.
In 1965, the company approached a rapidly growing business in the market, Fairchild Semiconductor Corporation and agreed to serve as a sales agency for them, increasing their capital to twenty million yen and began exporting IC testers, IC sockets, IC connectors, and other similar computer components.
The company opened an office in San Francisco, California and their new branch, Pan Electron in 1968 established themselves as the only stocking distributor of imported electronic components in the region.
One year later, they opened their Yokohama office and established Teltron, a major manufacturer and distributor of car stereos, expanding their headquarters to fill the entire TBS-2 building and raising their capital to 100 million yen.
Semiconductor Production Equipment (SPE)
TEL produces Semiconductor Production Equipment (SPE) for the following purposes:
In July 2014, TEL announced the establishment of joint assembly lab with Institute of Microelectronics in Singapore. The lab is focused on the research and development of Wafer Level Packaging and assembly, to address the need of Internet of Things with devices of high performance and low power consumption.